While Samtec makes every effort to present excellent information, it does not warrant the models are without error or defect or the use of the models in terms of accuracy, reliability or otherwise. This specification standardizes the way in which mezzanine cards communicate and connect to host boards. Samtec Expands Channel with Avnet in Asia. Models were developed using nominal values for physical dimensions and material properties and specific grounding and boundary conditions. For questions regarding the VITA If you continue to experience issues please contact ehelpdesk samtec. Explore Start your design quickly with our vast library of online resources and engineering support.

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This standard addresses communication between VME boards using the P2 connector. This standard was withdrawn in and is provided for historical reference only. FPDP consists of a multi-drop synchronous parallel non-addressable bus link between multiple boards in a single chassis. The link is made to a connector on the front panel of each board by means of an eighty conductor ribbon cable.

The purpose of this standard is to allow products to be designed to work with other FPDP products. The degree of interoperability may depend on the layers of functionality above the physical and data link layers. These higher layers are not part of this standard.

Included in this definition are the data frame structure, the link layer protocol, and the physical media requirements. This can be done by both increasing the speed of the link, and by providing the ability to channel bond several lanes together. The VITA In addition, the VITA Included in this definition are various user data framing methods, supported system configurations, and the Link Layer Protocol.

VITA This standard defines the media access control layer for the BusNet backplane software protocol. This standard defines the link layer control layer for the Busnet backplane software protocol.

This standard defines a software application interface for VMEbus modules. This standard addresses communication between VME boards using interconnect either on the front panel or on the backplane. The communication may use cables or an overlay such as a backplane. The standard defines the interface between a VME board and Myrinet, allowing not only intra-subrack, board-to-board communication, but also a uniform extension for inter-subrack, inter-cabinet, and even local-area-network LAN communication.

This standard includes, either directly or by reference, the specification of the Data Link level, timing information, character set, signals, and the details of the connectors. The designers utilized IEC 2 mm based connectors to increase connector pin counts and to facilitate the adoption of certain architectural features and capabilities. Physical features required to incorporate these connectors into the IEEE This document provides a means to specify this information without including extensive details in the systems specifications.

The combination of Euroboard form factors and 2 mm connectors has been utilized in other system architectures and is anticipated to be included in future systems. This specification defines a variety of configurations that combine Euroboards and 2 mm connectors in a manner that facilitates references to such architecture in such current and future applications.

Other uses for this specification are in no way prohibited. The aim is to ensure mechanical interchangeability of conduction-cooled circuit card assemblies in a format suitable for military and rugged applications and to ensure their compatibility with both conduction cooled chassis and commercial, air-cooled, single height 3U and double-height 6U x mm, Euroboard chassis.

Typical applications include power supplies or other power management devices. It has been developed to aid in the design of equipment where such connectors are typically found. The information included consists of interface and profile dimensions, printed board layout dimensions, suggested or actual signal and power pin assignments as well as information regarding standards that may exist for the connectors. No consideration is given to current carrying capacities of the connector systems nor to the optimization or validity of any pin assignment schemes, which may be included.

Similarly, if connector locations are given relative to common industry board practices, they are not to be assumed to be the sole possible location of such connectors. Power connectors are defined, for the purpose of this standard, as separable connectors that are designed to provide current to devices at levels consistent with the overall operating power of the device.

As such, they must have at least one 1 contact capable of carrying five 5 amps or more of electrical current. PICMG 2. Processor PMC cards are used where modular attachment of a processor is desired. As such, Processor PMCs increase the modularity of a computer system and thus complement, rather than compete with, the existing family of PMC cards. Processor PMC cards are expected to electrically operate with existing carrier boards or motherboards ; that is, while the carrier may be redesigned to take advantage of the enhanced functions that are offered by this standard, such a redesign should not be a requirement to insure proper operation.

Four mappings are provided. IPMI describes a hardware independent interface between chassis sensors and the operating system. This document describes a service indicator standard that seeks to be as compatible as possible with existing indicator standards and their extensions across different product markets.

This standard addresses the meaning and application of specific colors to service indicators. This standard also defines and assigns meanings to specific approved behaviors or states for each color. It specifies where indicators must be placed and in what order, and it specifies luminance levels and viewing angles. The ratio of one high-speed connector per payload board to many on the switch card lends itself to a star topology where each payload card is connected to a central switch.

Interswitch links may be included for reliability and load balancing reasons as well. Although this topology is not required it is a natural fit for the system features. The requirements and design rules defined in this specification are intended to be consistent with the applicable sections of the InfiniBand Specification. It is expected that VXS. Out-of-band management. The guidelines and design rules defined in this specification are intended to be consistent with the applicable sections of the IEEE In support of these goals, this document specifies the mechanical and generic electrical requirements necessary to serve as a basis for any number of protocol layer standards built on and complying with this standard.

The objectives of this document are: - To assign Parallel RapidIO signals for communication over the high-speed connectors and data links defined in XMC. The guidelines and design rules defined in this standard are intended to be consistent with the applicable sections of the Parallel RapidIO Specification.

It is expected that XMC. The guidelines and design rules defined in this standard are intended to be consistent with the applicable sections of the Serial RapidIO specification. It also defines an increased power envelope including a 48V profile, and additional cooling methods. The VITA 46 base standard defines physical features that enable high-speed communication in a compliant system.

The base standard also defines similar physical features for 3U by mm by 4HP pitch Eurocard format, providing the same two types of connector options discussed above for 6U plug-in modules. Many features called for in the base specification will be compatible with the requirements of other standards, such as VITA, but this standard concerns only the IEEE compatible applications.

This base standard also defines alignment and keying features used to protect the connector system. The base standard does not address the possible serial fabric configurations available in systems which utilize the standard. ANSI Ratified.



An overview is presented of the FMC standard and the benefits it provides to developers. However, this still requires a board redesign and respin. This approach separates FPGA board designs into two pieces - a carrier and a mezzanine. The carrier contains one or more FPGAs and the associated functionality that will always be common to any variation of the board design. These benefits include shorter design cycles, increased ease in taking advantage of technology advances, and lower development and recurring costs. An overview of the standard follows. The standard defines two widths - single and double width.




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